Now, the Linea™ HS 16k multifield TDI camera from Teledyne DALSA is in volume production. The Linea can simultaneously capture up to three images in a single shot using light sources of different wavelengths. The integrated charge-domain CMOS TDI sensor with 16k x (64+128+64) TDI arrays and a pixel size of 5x5 µm uses advanced coated wafer-level dichroic filters with minimal spectral crosstalk to spectrally isolate the three images. The camera also features a high-speed CLHS interface that delivers up to 8.4 gigapixels per second over a single, long fiber optic cable.
“The advanced technology of multifield imaging sets the camera apart from other line scan cameras. The dichroic filters overcome the spectral crosstalk of conventional color filters and enable image isolation within the spectral range.”
- Xing-Fei He, Senior Product Manager
The product greatly improves inspection speed and image quality. It eliminates the need to capture multiple images, increasing the throughput of inspection systems and improving defect detection by minimizing the effect of mechanical vibration.
The camera is ideally suited for applications such as flat panel display, printed circuit board (PCB) and semiconductor wafer inspection; web inspection of paper, film, metal foil and textiles; and general machine vision and scientific applications. The camera can also be used to capture color images with a white light source. The spectral characteristics of dichroic filters provide a unique color representation that can be used for improved defect detection.
